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1.0 Foreword
Introduction to our comprehensive circuit board repair and rework guidebook.
Conformance Level: N/A | Minimum Skill Level: N/A
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2.0 Basic Procedures
List of procedures covering handling, cleaning, coatings, baking, legends, and epoxy mixing.
Conformance Level: N/A | Minimum Skill Level: N/A
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2.1 Handling Electronic Assemblies
Procedure covers ESD, EOS, safe work areas and handling and storage methods.
Conformance Level: High | Minimum Skill Level: Intermediate
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2.2 Cleaning
Procedure outlines various cleaning methods for circuit board assemblies.
Conformance Level: N/A | Minimum Skill Level: N/A
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2.2.1 Cleaning, Local
Procedure covers localized cleaning of circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Intermediate
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2.2.2 Cleaning, Aqueous Batch Process
Procedure covers aqueous batch cleaning of circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Intermediate
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2.3.1 Coating Removal, Identification of Coating
Procedure covers the techniques for identifying various circuit board coatings.
Conformance Level: High | Minimum Skill Level: Advanced
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2.3.2 Coating Removal, Solvent Method
Procedure covers the methods for removal of coatings on circuit board assemblies using solvents.
Conformance Level: High | Minimum Skill Level: Advanced
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2.3.3 Coating Removal, Peeling Method
Procedure covers the methods for removal of thick coatings on circuit board assemblies using a peeling method.
Conformance Level: High | Minimum Skill Level: Advanced
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2.3.4 Coating Removal, Thermal Method
Procedure covers the methods for removal of coatings on circuit board assemblies using heat to overcure the coating.
Conformance Level: High | Minimum Skill Level: Advanced
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2.3.5 Coating Removal, Grinding/Scraping Method
Procedure covers the methods for removal of coatings on circuit boards assemblies using various grinding and scraping processes.
Conformance Level: High | Minimum Skill Level: Expert
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2.3.6 Coating Removal, Micro Blasting Method
Procedure covers the methods for removal of coatings on circuit boards assemblies using a micro abrasive blasting system.
Conformance Level: High | Minimum Skill Level: Expert
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2.4.1 Coating Replacement, Solder Mask
Procedure covers the methods for replacement of coatings and solder mask on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Intermediate
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2.4.2 Coating Replacement, Conformal Coating, Encapsulant
Procedure covers the methods for replacement of conformal coatings on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Intermediate
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2.4.3 Coating Replacement, Solder Mask, BGA Locations
Procedure covers the methods for replacement of of solder mask on circuit board assemblies at BGA component locations.
Conformance Level: High | Minimum Skill Level: Intermediate
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2.5 Baking and Preheating
Procedure covers baking and heating methods for circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Intermediate
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2.6.1 Legend/Marking, Stamping Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards assemblies.
Conformance Level: High | Minimum Skill Level: Intermediate
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2.6.2 Legend Marking, Hand Lettering Method
Procedure covers the methods for repair and replacement of legend and markings on circuit board assemblies
Conformance Level: High | Minimum Skill Level: Intermediate
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2.6.3 Legend Marking, Stencil Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
Conformance Level: High | Minimum Skill Level: Intermediate
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2.7 Epoxy Mixing and Handling
Procedures covering method for epoxy mixing for use on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Intermediate
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3.0 Base Board Procedures
Procedures covering bow and twist repair, repair of non-plated holes and slots and base board repair.
Conformance Level: N/A | Minimum Skill Level: N/A
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3.1 Delamination/Blister Repair, Injection Method
Procedure covers delamination and blister repair on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Advanced
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3.2 Bow and Twist Repair
Procedure covering bow and twist repair on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Intermediate
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3.3.1 Hole Repair, Epoxy Method
Procedure covers minor repair of non-plated holes on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Advanced
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3.3.2 Hole Repair, Transplant Method
Procedures covers major repair of damage to non-plated holes on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Expert
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3.4.1 Key and Slot Repair, Epoxy Method
Procedure covers minor repair of key slots on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Advanced
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3.4.2 Key and Slot Repair, Transplant Method
Procedure covers major of key slots on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Expert
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3.5.1 Base Material Repair, Epoxy Method
Procedure covers minor repair of damaged base board around edges on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Advanced
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3.5.2 Base Material Repair, Area Transplant Method
Procedure covers major repair of damaged base board within the inner area on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Expert
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3.5.3 Base Material Repair, Edge Transplant Method
Procedure covers major repair of damaged base board around edges on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Expert
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4.0 Conductor Procedures
Procedures cover repair of conductors, lands, pads, edge contacts, surface and internal circuits.
Conformance Level: N/A | Minimum Skill Level: N/A
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4.1.1 Lifted Conductor Repair, Epoxy Method
Procedure to repair lifted conductors and circuits using liquid epoxy.
Conformance Level: High | Minimum Skill Level: Intermediate
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4.1.2 Lifted Conductor Repair, Film Adhesive Method
Procedure to repair lifted conductors and circuits using a dry film epoxy method.
Conformance Level: High | Minimum Skill Level: Intermediate
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4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
Procedure covers repair of damaged conductors and circuits using liquid epoxy.
Conformance Level: High | Minimum Skill Level: Advanced
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4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
Procedure covers repair of damaged conductors and circuits using a dry film epoxy method.
Conformance Level: High | Minimum Skill Level: Advanced
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4.2.3 Conductor Repair, Welding Method
Procedure covers repair of damaged conductors and circuits using a welding method.
Conformance Level: High | Minimum Skill Level: Advanced
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4.2.4 Conductor Repair, Surface Wire Method
Procedure covers repair of damaged conductors and circuits using a surface jumper wire.
Conformance Level: Medium | Minimum Skill Level: Intermediate
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4.2.5 Conductor Repair, Through Board Wire Method
Procedure covers repair of damaged conductors and circuits using a jumper wire feeding through the circuit board assembly.
Conformance Level: Medium | Minimum Skill Level: Advanced
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4.2.6 Conductor Repair, Inner Layer Method
Procedure covers repair damaged conductors and circuits on inner layers on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Expert
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4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method
Procedure covers repair of damage to surface ground planes on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Advanced
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4.3.1 Circuit Cut, Surface Circuits
Procedure covers methods to cut surface conductors on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Advanced
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4.3.2 Circuit Cut, Inner Layer Circuits
Procedure covers method to cut inner layer conductors and circuits on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Advanced
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4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through Method
Procedure covers method to delete connections at a plated through hole on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Advanced
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4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method
Procedure covers method to delete connections at a plated through hole on circuit board assemblies by cutting the plated hole traces.
Conformance Level: High | Minimum Skill Level: Expert
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4.4.1 Lifted Land Repair, Epoxy Seal Method
Procedure covers method to repair lifted lands on circuit board assemblies using liquid epoxy.
Conformance Level: Medium | Minimum Skill Level: Advanced
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4.4.2 Lifted Land Repair, Film Adhesive Method
Procedure covers method to repair lifted lands on circuit board assemblies using dry film adhesive.
Conformance Level: Medium | Minimum Skill Level: Advanced
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4.5.1 Land Repair, Epoxy Method
Procedure covers method to repair damaged lands on circuit board assemblies using liquid epoxy.
Conformance Level: Medium | Minimum Skill Level: Advanced
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4.5.2 Land Repair, Film Adhesive Method
Procedure covers method to repair damaged lands on circuit board assemblies using dry film adhesive.
Conformance Level: High | Minimum Skill Level: Advanced
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4.6.1 Edge Contact Repair, Epoxy Method
Procedure covers method to repair damaged edge contacts on circuit board assemblies using liquid epoxy.
Conformance Level: Medium | Minimum Skill Level: Advanced
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4.6.2 Edge Contact Repair, Film Adhesive Method
Procedure covers method to repair damaged edge contacts on circuit board assemblies using dry film adhesive.
Conformance Level: High | Minimum Skill Level: Advanced
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4.6.3 Edge Contact Repair/Rework, Plating Method
Procedure covers method to repair damaged to the plating of edge contacts on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Advanced
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4.7.1 Surface Mount Pad Repair, Epoxy Method
Procedure covers method to repair damaged surface mount pads on circuit board assemblies using liquid epoxy.
Conformance Level: Medium | Minimum Skill Level: Advanced
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4.7.2 Surface Mount Pad Repair, Film Adhesive Method
Procedure covers method to repair damaged surface mount pads on circuit board assemblies using dry film adhesive.
Conformance Level: High | Minimum Skill Level: Advanced
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4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method
Procedure covers method to repair damaged BGA pads on circuit board assemblies using dry film adhesive.
Conformance Level: High | Minimum Skill Level: Advanced
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4.7.4 Surface Mount, BGA Pad with Integral Via Repair
Procedure covers method to repair damaged BGA pads that have an integral via on circuit board assemblies.
Conformance Level: Medium | Minimum Skill Level: Expert
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4.7.5 Surface Mount, BGA Pad, Integral Via, Circuit Extension Method
Procedure covers method to repair damaged BGA pads that have an integral via on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Expert
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5.0 Plated Hole Procedures
List of procedures to repair damaged plated holes on circuit board assemblies.
Conformance Level: N/A | Minimum Skill Level: N/A
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5.1 Plated Hole Repair, No Inner Layer Connection
Procedure to repair damaged plated holes without inner layer connections on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Intermediate
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5.2 Plated Hole Repair, Double Wall Method
Procedure to repair damaged plated holes that have an inner inner layer connection on circuit board assemblies.
Conformance Level: Medium | Minimum Skill Level: Advanced
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5.3 Plated Hole Repair, Inner Layer Connection
Procedure to repair damaged plated holes that have an inner inner layer connection on circuit board assemblies.
Conformance Level: Medium | Minimum Skill Level: Expert
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6.0 Jumper Wire and Component Modification Procedures
List of procedures covering jumper wires, modifications, and component lead cutting and lifting.
Conformance Level: N/A | Minimum Skill Level: N/A
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6.1 Jumper Wires
Procedure covers methods for using jumper wires on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Intermediate
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6.2.1 Jumper Wires, BGA Components, Circuit Track Method
Procedure covers methods for using circuit tracks at BGA locations on circuit board assemblies.
Conformance Level: Medium | Minimum Skill Level: Expert
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6.2.2 Jumper Wires, BGA Components, Through Board Method
Procedure covers methods for using jumper wires at BGA locations on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Expert
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6.3 Component Modifications and Additions
Procedure covers various component modifications and additions on circuit board assemblies.
Conformance Level: N/A | Minimum Skill Level: Advanced
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6.4 Component Lead Cutting and Lifting
Procedure covers methods for cutting and lifting component leads on circuit board assemblies.
Conformance Level: Medium | Minimum Skill Level: Advanced
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6.5 Component Trim and Form
Procedure covers methods for triming and forming leads on electronic components.
Conformance Level: High | Minimum Skill Level: Expert
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7.0 Soldering Procedures
Procedures including soldering basics, acceptance criteria, and soldering of through hole and surface mount components.
Conformance Level: N/A | Minimum Skill Level: N/A
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7.1.1 Soldering Basics
Procedure covers the basic concepts for high quality soldering on circuit board assemblies.
Conformance Level: N/A | Minimum Skill Level: Intermediate
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7.1.2 Preparation For Soldering And Component Removal
Procedure covers preparation prior to soldering and component removal on circuit board assemblies.
Conformance Level: N/A | Minimum Skill Level: Intermediate
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7.1.3 Solder Joint Acceptance Criteria
Page covers includes tables and illustrations covering solder joint acceptance criteria on circuit board assemblies.
Conformance Level: N/A | Minimum Skill Level: Intermediate
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7.2.1 Soldering Through Hole Components, Point To Point Method
Procedure covers soldering of through hole components using point to point hand soldering.
Conformance Level: Medium | Minimum Skill Level: Intermediate
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7.2.2 Soldering Through Hole Components, Solder Fountain Method
Procedure covers soldering of through hole components on circuit board assemblies using a solder fountain system.
Conformance Level: High | Minimum Skill Level: Expert
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7.3.1 Soldering Surface Mount Chip Components, Point To Point Method
Procedure covers soldering of surface mount chip components on circuit board assemblies using a point to point soldering method.
Conformance Level: High | Minimum Skill Level: Intermediate
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7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method Method
Procedure covers soldering of surface mount chip components on circuit board assemblies using a hot gas method.
Conformance Level: Medium | Minimum Skill Level: Intermediate
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7.4.1 Soldering Surface Mount J Lead Components, Point To Point Method
Procedure covers soldering of surface mount J lead components on circuit board assemblies using a point to point soldering method.
Conformance Level: High | Minimum Skill Level: Intermediate
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7.4.2 Soldering Surface Mount J Lead Components, Continuous Flow Method
Procedure covers soldering of surface mount J lead components on circuit board assemblies using a continuous flow soldering method.
Conformance Level: High | Minimum Skill Level: Intermediate
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7.4.3 Soldering Surface Mount J Lead Components, Hot Gas Method
Procedure covers soldering of surface mount J lead components on circuit board assemblies using a hot gas method.
Conformance Level: High | Minimum Skill Level: Intermediate
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7.5.1 Soldering Surface Mount Gull Wing Components, Point To Point Method
Procedure covers soldering of surface mount gull wing components on circuit board assemblies using a point to point soldering method.
Conformance Level: High | Minimum Skill Level: Intermediate
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7.5.2 Soldering Surface Mount Gull Wing Components, Continuous Flow Method
Procedure covers soldering of surface mount gull wing components on circuit board assemblies using a continuous flow soldering method.
Conformance Level: High | Minimum Skill Level: Intermediate
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7.5.3 Soldering Surface Mount Gull Wing Components, Hot Gas Method
Procedure covers soldering of surface mount gull wing components on circuit board assemblies using a hot gas method.
Conformance Level: High | Minimum Skill Level: Intermediate
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8.0 Rework Procedures
List of procedures covering removal of through hole, chip and surface components.
Conformance Level: N/A | Minimum Skill Level: N/A
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8.1.1 Component Removal, Through Hole Components, Vacuum Method
Procedure covers removal of through hole components on assembled circuit boards using a point to point vacuum method.
Conformance Level: High | Minimum Skill Level: Intermediate
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8.1.2 Component Removal, Through Hole Components, Solder Fountain Method
Procedure covers removal of through hole components on circuit board assemblies using a solder fountain system.
Conformance Level: Medium | Minimum Skill Level: Expert
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8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method
Procedure covers removal of surface mount chip components on circuit board assemblies using a forked tip method.
Conformance Level: High | Minimum Skill Level: Intermediate
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8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Procedure covers removal of surface mount chip components on circuit board assemblies using a hot tweezer method.
Conformance Level: High | Minimum Skill Level: Intermediate
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8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method
Procedure covers removal of surface mount J lead components on circuit board assemblies using a conduction method.
Conformance Level: High | Minimum Skill Level: Advanced
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8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas Method
Procedure covers removal of surface mount J lead components on circuit board assemblies using a hot gas method.
Conformance Level: High | Minimum Skill Level: Advanced
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8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method
Procedure covers removal of surface mount gull wing components on circuit board assemblies using a conduction method.
Conformance Level: High | Minimum Skill Level: Advanced
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8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas Method
Procedure covers removal of surface mount gull wing components on circuit board assemblies using a hot gas method.
Conformance Level: High | Minimum Skill Level: Advanced
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9.0 BGA Component Rework and Reballing Procedures
List of procedures covering BGA component rework and reballing on circuit board assemblies.
Conformance Level: N/A | Minimum Skill Level: N/A
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9.1.1 BGA Component Rework Process Flow
Procedure reviews the component review process prior to reworking BGA components on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Advanced
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9.1.2 BGA Component Rework Inspection
Procedure covers guidelines for inspection of reworked BGA components on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Advanced
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9.1.3 BGA Component Reball Inspection
Procedure covers guidelines for inspection of reballed BGA components.
Conformance Level: High | Minimum Skill Level: Expert
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9.2.1 BGA Component Rework Profile Development, Standard Method
Procedure covers process steps to develop a BGA rework profile on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Advanced
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9.2.2 BGA Component Rework Profile Development, Smart Track Method
Procedure covers process steps to develop a BGA rework profile on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Expert
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9.3.1 BGA Component Rework
Procedure covers methods for BGA component rework on circuit board assemblies.
Conformance Level: High | Minimum Skill Level: Advanced
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9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method
Procedure covers BGA component reballing using solder braid ball removal and mini-oven attachment.
Conformance Level: High | Minimum Skill Level: Expert
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9.4.2 BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method
Procedure covers BGA component reballing using solder braid ball removal and reflow oven attachment.
Conformance Level: High | Minimum Skill Level: Expert
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9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
Procedure covers BGA component reballing using robotic ball removal and mini-oven attachment.
Conformance Level: High | Minimum Skill Level: Expert
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9.4.4 BGA Component Reballing, Robotic Ball Removal Reflow, Reflow Oven Attachment Method
Procedure covers BGA component reballing using robotic ball removal and reflow oven attachment.
Conformance Level: High | Minimum Skill Level: Expert
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9.5.1 BGA Component Removal, Machining Method
Procedure covers the process for removing a BGA component that was installed using non-reworkable underfill.
Conformance Level: High | Minimum Skill Level: Expert
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10.0 Component Tinning Procedures
List of procedures covering tinning for various component types.
Conformance Level: N/A | Minimum Skill Level: N/A
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10.1.1 Component Tinning Basics
The guides covers the basic requirements for replacing the finish on various types of electronic component leads.
Conformance Level: N/A | Minimum Skill Level: N/A
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10.2.1 Tinning, Chip/Discrete Components, Manual
This procedure covers manual tinning of chip and discrete components.
Conformance Level: Medium | Minimum Skill Level: Expert
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10.2.2 Tinning, Chip/Discrete Components, Robotic
This procedure covers robotic tinning of chip and discrete components.
Conformance Level: High | Minimum Skill Level: Expert
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10.3.1 Tinning, Radial Lead Components, Manual
This procedure covers manual tinning of radial lead components.
Conformance Level: Medium | Minimum Skill Level: Expert
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10.3.2 Tinning, Radial Lead Components, Robotic
This procedure covers robotic tinning of radial lead components.
Conformance Level: High | Minimum Skill Level: Expert
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10.4.1 Tinning, Axial Lead Components, Manual
This procedure covers manual tinning of axial lead components.
Conformance Level: Medium | Minimum Skill Level: Expert
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10.4.2 Tinning, Axial Lead Components, Robotic
This procedure covers robotic tinning of axial lead components.
Conformance Level: High | Minimum Skill Level: Expert
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10.5.1 Tinning, TSOP/SOIC Components, Manual
This procedure covers manual tinning of TSOP, TSSOP, SSOP and SOIC components.
Conformance Level: Medium | Minimum Skill Level: Expert
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10.5.2 Tinning, TSOP/SOIC Components, Robotic
This procedure covers robotic tinning of TSOP and SOIC components.
Conformance Level: High | Minimum Skill Level: Expert
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10.6.1 Tinning, QFP/PLCC Components, Manual
This procedure covers manual tinning of QFP and PLCC components.
Conformance Level: Medium | Minimum Skill Level: Expert
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10.6.2 Tinning, QFP/PLCC Components, Robotic
This procedure covers robotic tinning of QFP and PLCC components.
Conformance Level: High | Minimum Skill Level: Expert
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10.7.1 Tinning, QFN/DFN Components, Manual
This procedure covers manual tinning of QFN and DFN components.
Conformance Level: Medium | Minimum Skill Level: Expert
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10.7.2 Tinning, QFN/DFN Components, Robotic
This procedure covers robotic tinning of QFN and DFN components.
Conformance Level: High | Minimum Skill Level: Expert
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10.8.1 Tinning, Connectors, Through-Hole, Manual
This procedure covers manual tinning of through-hole connectors.
Conformance Level: Medium | Minimum Skill Level: Expert
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10.8.2 Tinning, Connectors, Through-Hole, Robotic
This procedure covers robotic tinning of through-hole connectors.
Conformance Level: High | Minimum Skill Level: Expert
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