8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method

Procedure covers removal of surface mount chip components on circuit board assemblies using a hot tweezer method.

Minimum Skill Level: Intermediate
Conformance Level: High


REQUEST FOR QUOTE    GUIDES INDEX
slide 1
Component Removal, Surface Mount Chip Components, Hot Tweezer Method
slide 2
Place the tweezer tips in position. When the solder melts, lift the component off the circuit board
rework
Do you need help with surface mount and through-hole component rework or salvage? LEARN MORE
SLIDESHOW STARTING
Outline

This procedure covers one commonly used method for removing surface mount chip components.

Note: The goal when removing any component is to remove the component as quickly as possible.

Caution - Glued Components: A small dot of epoxy is often used to hold chip components in position during wave soldering processing. Typically these components will be located on the bottom side of a circuit board that has through-hole components located on the other side. Whenever you see a board like this, you can generally assume that the chip components will be glued onto the board. You'll need to leave the tip on the component for one or two additional seconds in order to transfer enough heat to over-cure or soften the adhesive. If required, take a wooden stick or curved tweezers and push the component sideways until the glue joint finally gives way.

Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Acceptability References
IPC-A-610 12.0 Surface Mount Assemblies
Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
7.1.1 Soldering Basics
7.1.2 Preparation For Soldering And Component Removal
7.1.3 Solder Joint Acceptability Criteria
IPC7711 3.3.2 Tweezer Method
Tools, Materials and Supplies

Procedure

Note: Determine the direction the part is to be swept off the circuit board surface. Densely packed circuit board assemblies often leave only one direction for the rework tool to follow when sweeping the part off the surface

Procedure

  1. Tin the hot tweezer tip.
  2. Apply a small amount of liquid flux to both ends of the component.
  3. Place the tweezer tips in contact with both ends of the component. When the solder melts, lift the component off the circuit board. (See Figure 1)
  4. Clean the area.
Images and Figures
Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Place the tweezer tips in position. When the solder melts, lift the component off the circuit board
Figure 1. Place the tweezer tips in position. When the solder melts, lift the component off the circuit board
Contact Us/Quote Request


Send Documents *
No file chosen
No file chosen
No file chosen
No file chosen
No file chosen

Notes/Questions/Requests

Product Type
Assemblies Bare PCBs Other

Quantity

Delivery Schedule Request
3 Weeks 2 Weeks 1 Week
2-3 Days 1 Day

Security Check



* You may upload PDFs and other file types (max 4 MB each). For multiple files, zip them or send to info@circuitrework.com

Form Security
Our forms run on AWS with an industry-leading firewall. Data is encrypted at rest with AES-256 and in transit using TLS 1.2+.
We're Here To Help.   
CONTACT US
Copyright © Circuit Technology Center, Inc. All Rights Reserved. | Privacy Policy | Terms of Use