9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method

1. Ensure all BGA components to be processed meet the requirements for acceptable moisture level.
   
   Note
   For information on baking and moisture level control see 2.5 Baking and Preheating
2. Remove existing solder spheres on BGA components using desolder braid. Place the de-solder braid on the balls to be removed and gently place the soldering iron on the desolder braid. Apply very light pressure to melt the solder balls. As the solder melts it will be drawn onto the copper desoldering braid by capillary action. Repeat as needed to remove all the solder balls. See Figure 1.
3. Clean the BGA components with approved cleaning solution. Cleaning solutions may be specified by customer or contract. Typical cleaning process may use a cleaning bush and cleaner. Gently brush the surface until all evidence of flux and debris have been removed. Dry with a clean wipe or blow dry using an air gun.

1. Apply tacky flux to the flat BGA component pads using a brush. Flux should be evenly applied across the entire BGA pad surface. Use minimal flux needed to fully cover the surface. Remove any excess flux. See Figure 2.
2. Place the BGA components into a fixture and cover with a matching stencil. Check to ensure the alignment is correct. See Figure 3.
3. Place a quantity of the appropriate size solder spheres into the fixture and use a clean cleaning brush to distribute the solder spheres so they fill all the open apertures in the BGA component stencil. Check to be sure all the apertures are filled with only one solder sphere. Tilt the fixture and pour the excess solder spheres into a collection container for reuse.
   
   Note
   Avoid overloading the solder stencil with excess solder spheres as they may wedge under the stencil. This will make lifting the stencil to remove any excess solder spheres difficult.
4. Place the component and fixture into the mini BGA reflow oven. See Figure 4.
5. Turn the Mini BGA reflow oven on and select the proper profile.
   
   Note
   If a profile has not been defined a profile will need to be created.
6. Close the cover of the Mini BGA reflow oven and press the start button. The oven will go through the required preheat, reflow and cooling cycles.
7. When the temperature has cooled below 100 C, use gloves and remove the reball fixture from the mini BGA reball oven once. Allow the fixture and components to cool for one minute to ensure package thermal stability prior to removing the BGA component from the fixture.
8. Visually inspect the BGA components balls for proper alignment and appearance.
9. Clean the BGA components in approved cleaning solution.
10. Inspect the body of the BGA component for abnormalities.
11. Inspect the BGA component for cleanliness.