8.0 Rework Procedures 8.0 Component Rework Procedures List of component removal and rework procedures, including removal of through-hole components, removal of chip components, removal of J lead components, and removal of gull-wing components. 8.1.1 Component Removal, Through Hole Components, Vacuum Method The procedure covers the removal of through-hole components on assembled circuit boards. 8.1.2 Component Removal, Through Hole Components, Solder Fountain Method The procedure covers the removal of through-hole components on assembled circuit boards. 8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method The procedure covers the removal of surface mount chip components on assembled circuit boards. 8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method The procedure covers the removal of surface mount chip components on assembled circuit boards. 8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method The procedure covers the removal of surface mount J lead components on assembled circuit boards. 8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method The procedure covers the removal of surface mount J lead components on assembled circuit boards. 8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method The procedure covers the removal of surface mount gull wing components on assembled circuit boards. 8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method The procedure covers the removal of surface mount gull wing components on assembled circuit boards. Procedure for reference only.