Circuit Technology Center is the industry's most trusted source for BGA rework services and have been qualified by companies around the world. Whether you have one board or one thousand boards for rework, we're the company to turn to for BGA rework services.
We have solutions for every type of BGA component rework or repair need. Services include: ✔ BGA component removal, replacement or salvage ✔ X-ray inspection ✔ Circuit pattern design changes at BGA sites ✔ Repair of lifted or missing BGA pads ✔ Repair of solder mask at BGA sites ✔ Re-balling of BGA components
We're equipped with 7 top-of-the line BGA rework systems and a staff of engineers and operators with in-depth knowledge and experience at the intricate process of BGA rework.
We x-ray each BGA rework site and check for anomalies to ensure the highest quality. We also offer x-ray inspection services using the latest technology in x-ray inspection.
This combination provides you with a repeatable process for every project meeting the highest quality standards.
We also replace missing or damaged BGA pads following IPC recommended procedures. These procedures use specially fabricated adhesive backed BGA pads that are thermally bonded top the board surface.
When your design requires a change or modification, using standard jumper wires is not normally an option. Jumper wires are simply to thick to fit under a BGA component. We pioneered an ingenious modification procedure using flat copper ribbon thin enough to fit under BGA components.
Component package types routinely reworked include:
PBGA (Plastic Ball Grid Array),
TBGA (Tape Ball Grid Array),
uBGA (Micro BGA),
CCGA (Ceramic Column Grid Array),
CBGA (Ceramic Ball Grid Array),
CPGA (Ceramic Pin Grid Array),
LGA (Land Grid Array),
QFN (Quad Flat No Leads),
PoP (Package on Package),
Multiple package stacks,
Test Probes and other BGA probes.