| August 16, 2022
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No matter how much we attempt to streamline and automate the process, BGA Rework has been, and will likely always be, a mixture of art and science. The need for a predictable, repeatable process, with its attendant time and cost savings, drives us continually to attempt to remove as much "art" as possible from the BGA rework process as new tools and knowledge become available. This is preferable to having the success of ...
Feature Story
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I believe BGA Solder Balls are a homogeneous mass of metals, why is the shelf life only two years? With proper handling and storage, can the shelf life be extended ...
Ask the Experts
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The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use various solder alloys containing low melting point elements such as tin, cadmium, or indium. However, this phenomenon most commonly occurs with tin. Historically, tin whiskers were avoided by adding lead (Pb) to the solder alloy used for component leads or pads, and circuit boards with ...
Learn More
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It's not unusual for circuit boards that have been fabricated to require additional milling to reduce that thickness on certain areas of the circuit board. This milling is nominally completed by the ...
Feature Story
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Data streams in the terahertz spectral region could meet the demand for unprecedented data transfer rates since it offers higher available bandwidth ...
Technology Briefing
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"Somebody broke into your computer, but it looks like the work of an inexperienced hacker."
Copyright © Randy Glasbergen
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Trivia
What does uranium become when it has lost all of its radioactivity?
See the answer below.
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Quote of the Week
"A lot of people are afraid of heights. Not me; I'm afraid of widths."
Steven Wright
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