| April 27, 2022
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BGA rework is a topic about which volumes have been written, and in most cases, the focus has been on component removal and replacement. However, equally important is the topic of BGA site modification, and the need for such modification often arises. A common type of BGA site modification is the need to add a jumper wire at a BGA site. One option is to run a jumper through a hole in the board. This method is typically used for ...
Feature Story
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We are having problems achieving the minimum hole of 75% on electrolytic capacitors using our wave soldering. What do you suggest?
Ask the Experts
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A new section, 10.0 Component Tinning Procedures including thirteen new procedures have been added to the popular online guidebook developed and written by Circuit Technology Center.
This free online guidebook now contains 115 step-by-step procedures focused on circuit board assembly, repair, rework, and modification, plus many procedures focused on electronic component tinning and reballing. Most procedures include illustrations, photographs, and videos and follow popular IPC standards ...
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For this repair, we're looking at the process of correcting baseboard damage or correcting a design error at an ejector handle location. The ejector handle is often held in place by a roll pin pressed into a non plated hole on the circuit board. When the ejector handle is retracted, the lever-action ejects ...
Feature Story
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Power transfer technology makes it possible to charge devices without using any wires or plugs. Devices can receive power anywhere within the charging area ...
Technology Briefing
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"I need to apply for a second mortgage so I can buy gas to drive to the bank to apply for a first mortgage."
Copyright © Randy Glasbergen
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Trivia
With reference to electronic components, what does the acronym SOIC stand for?
See the answer below.
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Quote of the Week
"A guy knows he's in love when he loses interest in his car for a couple of days."
Tim Allen
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