News Releases

May 11, 2022 New Article Details Electronic Device Salvage Process Considerations The industry-wide electronic device shortage has created an increasing demand for the selective salvage and reclamation of valuable and difficult-to-source ... March 17, 2022 New White Paper Discusses the Key Process Steps of High-Reliability BGA Re-Balling The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due ... March 9, 2022 Circuit Technology Center Doubles Component-Level Tinning Services Capacity Circuit Technology Center recently received and commissioned two additional Hentec Odyssey 1325 robotic hot solder dip (RHSD) machines. These new ... February 15, 2022 Circuit Technology Center Releases Thirteen New Component Tinning Procedures A new section, 10.0 Component Tinning Procedures, includes thirteen newly published procedures added to the popular online guidebook developed and ... January 5, 2022 New Technical Paper Covers Critical Considerations for Component Tin Whisker Mitigation The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use ...