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News Releases

September 26, 2022
Circuit Technology Center Expands BGA Re-balling Capacity
Circuit Technology Center announced it recently received and commissioned a second Heller 1707-MK III in-line solder reflow oven. This new ...
August 4, 2022
Technical Paper Details Essential Practices for Gold Mitigation of Electronic Components
Gold plating removal from the solderable surfaces of electronic components is required for many electronic components due to gold embrittlement ...
May 11, 2022
New Article Details Electronic Device Salvage Process Considerations
The industry-wide electronic device shortage has created an increasing demand for the selective salvage and reclamation of valuable and difficult-to-source ...
March 17, 2022
New White Paper Discusses the Key Process Steps of High-Reliability BGA Re-Balling
The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due ...
March 9, 2022
Circuit Technology Center Doubles Component-Level Tinning Services Capacity
Circuit Technology Center recently received and commissioned two additional Hentec Odyssey 1325 robotic hot solder dip (RHSD) machines. These new ...
February 15, 2022
Circuit Technology Center Releases Thirteen New Component Tinning Procedures
A new section, 10.0 Component Tinning Procedures, includes thirteen newly published procedures added to the popular online guidebook developed and ...
January 5, 2022
New Technical Paper Covers Critical Considerations for Component Tin Whisker Mitigation
The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use ...
October 7, 2021
Circuit Technology Center Releases Updated Rework and Repair Guidebook
Several new procedures covering Ball Grid Array component re-balling and inspection have been added to the popular online guidebook developed ...
September 16, 2021
Circuit Technology Center Enhances Robotic Hot Solder Dip Capability
Circuit Technology Center announces it has enhanced its component-level modification services capability with the addition of a robotic hot solder ...
August 18, 2021
Circuit Technology Center Announces Facility Expansion
Circuit Technology Center announces that it has expanded its Haverhill, Massachusetts facility by over 10,000 square feet. This facility expansion ...
August 3, 2021
Circuit Technology Center Commissions New XRF X-ray System
Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system ...
June 22, 2021
Circuit Technology Center Doubles Component-Level Modification Services Capacity
Circuit Technology Center has purchased two additional robotic hot solder dip (RHSD) machines from Hentec. The Odyssey 1325 systems are ...
May 12, 2021
Circuit Technology Center Details Component Salvage and Harvest Capabilities
For over 35 years, Circuit Technology Center has been dedicated to the repair and rework of printed circuit boards. Due ...
March 22, 2021
Circuit Technology Center Expands Component Modification Services Capabilities
Circuit Technology Center announces that it has recently installed and commissioned a second robotic hot solder dip (RHSD) machine, expanding ...
February 24, 2021
Circuit Technology Center Defines New Procedure for Rework of BGA's Underfilled with Non-reworkable Underfill Epoxy
Circuit Technology Center is frequently tasked with the selective rework of BGA devices that have been underfilled with “non-reworkable” underfill ...