News Releases

September 26, 2022 Circuit Technology Center Expands BGA Re-balling Capacity Circuit Technology Center announced it recently received and commissioned a second Heller 1707-MK III in-line solder reflow oven. This new ... August 4, 2022 Technical Paper Details Essential Practices for Gold Mitigation of Electronic Components Gold plating removal from the solderable surfaces of electronic components is required for many electronic components due to gold embrittlement ... May 11, 2022 New Article Details Electronic Device Salvage Process Considerations The industry-wide electronic device shortage has created an increasing demand for the selective salvage and reclamation of valuable and difficult-to-source ... March 17, 2022 New White Paper Discusses the Key Process Steps of High-Reliability BGA Re-Balling The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due ... March 9, 2022 Circuit Technology Center Doubles Component-Level Tinning Services Capacity Circuit Technology Center recently received and commissioned two additional Hentec Odyssey 1325 robotic hot solder dip (RHSD) machines. These new ... February 15, 2022 Circuit Technology Center Releases Thirteen New Component Tinning Procedures A new section, 10.0 Component Tinning Procedures, includes thirteen newly published procedures added to the popular online guidebook developed and ... January 5, 2022 New Technical Paper Covers Critical Considerations for Component Tin Whisker Mitigation The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use ... October 7, 2021 Circuit Technology Center Releases Updated Rework and Repair Guidebook Several new procedures covering Ball Grid Array component re-balling and inspection have been added to the popular online guidebook developed ... September 16, 2021 Circuit Technology Center Enhances Robotic Hot Solder Dip Capability Circuit Technology Center announces it has enhanced its component-level modification services capability with the addition of a robotic hot solder ... August 18, 2021 Circuit Technology Center Announces Facility Expansion Circuit Technology Center announces that it has expanded its Haverhill, Massachusetts facility by over 10,000 square feet. This facility expansion ... August 3, 2021 Circuit Technology Center Commissions New XRF X-ray System Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system ... June 22, 2021 Circuit Technology Center Doubles Component-Level Modification Services Capacity Circuit Technology Center has purchased two additional robotic hot solder dip (RHSD) machines from Hentec. The Odyssey 1325 systems are ... May 12, 2021 Circuit Technology Center Details Component Salvage and Harvest Capabilities For over 35 years, Circuit Technology Center has been dedicated to the repair and rework of printed circuit boards. Due ... March 22, 2021 Circuit Technology Center Expands Component Modification Services Capabilities Circuit Technology Center announces that it has recently installed and commissioned a second robotic hot solder dip (RHSD) machine, expanding ... February 24, 2021 Circuit Technology Center Defines New Procedure for Rework of BGA's Underfilled with Non-reworkable Underfill Epoxy Circuit Technology Center is frequently tasked with the selective rework of BGA devices that have been underfilled with “non-reworkable” underfill ...