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New Technical Paper Covers Critical Considerations for Component Tin Whisker Mitigation

January 5, 2022

The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use various lead-free solder alloys containing low melting point elements such as tin, cadmium, or indium. In this new technical paper, Circuit Technology Center discusses a number of critical considerations when using robotic hot solder dip to process components to mitigate tin whiskers prior to circuit board assembly.

See the full paper at: https://www.circuitrework.com/features/1037.html