Circuit Technology Center

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Jeff Ferry, President
Circuit Technology Center

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Jun 22, 2022
Rework for Internal Conductor Mismatch
The team at Circuit Technology Center was tested when a large OEM discovered a design problem with fifty prototype boards. Two pairs of .005" wide ...
May 25, 2022
Keys to Component Lead Tinning Success
The motivation behind component lead tinning is to facilitate the removal of gold plating to eliminate the risk of gold embrittlement, tin whisker mitigation, or ...
Apr 27, 2022
BGA Component Site Modification - Is it Possible?
BGA rework is a topic about which volumes have been written, and in most cases, the focus has been on component removal and replacement. However, ...
Mar 28, 2022
Essential Practices for Gold Mitigation of Electronic Components
Since gold plating dissolves rapidly during the soldering process, the remaining gold within a solder joint can weaken the integrity of the interconnection. If this ...